What are the functions, advantages of vacuum potting technology, and how to achieve vacuum potting?
Vacuum potting machines are increasingly widely used in the electronics industry, especially in the packaging of electronics products such as transformers, relays, power supplies, motor coils, motor stators and rotors, etc. Many products require potting operations in a vacuum environment.
What is the vacuum potting process?
The vacuum potting process is an automatic potting operation method that ensures the product operates under absolute negative pressure. Place the product in the vacuum chamber, then remove the air inside the vacuum chamber to bring it to a negative pressure state, and then automatically pour the mixed AB glue into the product. That is the "vacuum potting process"
To achieve the vacuum potting process, a vacuum potting machine needs to be used for the operation. The biggest difference between vacuum glue injection machines and ordinary glue injection machines. It's just that there is an additional vacuum chamber. After vacuuming inside the box, the glue injection operation is carried out.
Second, the vacuum potting process is mostly used to solve the problem of potting bubbles:
First, understand the concept of bubbles. Glue bubbles can be classified into physical bubbles and chemical bubbles. Physical bubbles refer to the air bubbles produced during all the processes when the glue comes into contact with the air after being opened from the bucket. Chemical bubbles refer to the tiny air bubbles that gradually form in the gaps between molecules within the glue during the reaction process of the glue.
1. Solve the problem of a large number of bubbles (generally referring to physical bubbles) generated after potting:
At present, many products are filled with glue in an atmospheric environment. The glue filling machine equipment is equipped with a vacuum function in the AB glue bucket, so that no bubbles will be generated inside the glue filling machine. In most cases, the requirements for glue injection production can already be met at this point.
However, some manufacturers may find that after the glue bucket is evacuated and normal glue is filled, there are still a large number of bubbles, and they cannot be discharged by themselves. The product was placed in a vacuum box for vacuuming, and measures such as defoaming agent and alcohol spraying were ineffective. This situation belongs to the bubbles produced after the glue injection action. It is produced in the process of injecting glue from the mixing tube into the product. This problem can be solved by using vacuum potting equipment.
2. A small number of bubbles hidden inside the glue (generally referring to chemical bubbles) :
The original design intention of some electronic products is to serve the entire usage cycle and be non-repairable. If this type of product is filled with glue in an atmospheric environment, a few bubbles will be hidden inside the glue. After a certain period of use, the probability of the product malfunctioning will increase. Malfunctions usually do not occur quickly and may happen after several months or years of use. The vacuum potting machine can provide quality assurance for such demanding potting and potting.
3. To enable the glue with high viscosity to penetrate the product gaps more easily:
Some manufacturers use two-component AB glue with relatively high viscosity and poor fluidity. When the structure of the products they need to glue is relatively precise and complex, these adhesives with poor fluidity are difficult to penetrate and fill all the gaps of the products. When filling the glue under vacuum conditions, it can help the glue effectively and naturally penetrate into every crevice.
The effect after eliminating bubbles using the vacuum potting process.
As mentioned earlier, the impact of bubbles on the product. The use of a vacuum glue filling machine can make the glue filling homogenized. After curing, the surface is smooth and the product is completely filled inside without any bubbles. This method can reduce the probability of product failure affected by factors such as bubbles.